Navigate Your Way to a Career in Semiconductors @ NCKU-Tainan

TSMC created the semiconductor Dedicated IC Foundry business model when it was founded in 1987. In 2024, TSMC served 522 customers and manufactured 11,878 products for various applications covering a variety of end markets including high performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. Annual capacity of the manufacturing facilities managed by TSMC and its subsidiaries is approximately 17 million 12-inch equivalent wafers in 2024.

NCKU’s Academy of Innovative Semiconductor and Sustainable Manufacturing is the first to launch at a university to address the nation’s high-tech talent constraints and the imperative for advancing semiconductor technology during the AI era based on the National Cheng Kung University’s well-established research foundation in science and engineering. To this end, the Academy offers five graduate degree programs respectively on Integrated Circuit Design, Semiconductor Process Technology, Semiconductor Packaging and Testing, Key Materials, and Smart and Sustainable Manufacturing. The programs have been aimed at fostering future talents equipped with the “data-driven & energy-sensitive” core competency applicable to the whole spectrum of the semiconductor industry and continuously supporting the industry’s competitiveness on an innovative educational platform.

Established in 1931 as Tainan Technical College and renamed as Taiwan Provincial College of Engineering in 1946, it has solid foundation in engineering. Other areas were developed afterwards a long time, making it a comprehensive university and turned into National Cheng Kung University (NCKU) in 1971. In 2005, NCKU was recognized by Taiwan’s Ministry of Education as a member of the ‘Top University Project’ which granted more educational resources to NCKU

Founded in 1954, Advantest is the leading manufacturer of automatic test equipment used in the production of semiconductors for 5G, IoT, autonomous vehicles, high-performance computing (HPC), and more. The company also develops test-interface solutions for wafer sort and final test, and offers system-level test solutions. Learn more at www.advantest.com.

ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. With strong leadership in heterogeneous integration, manufacturing efficiencies, and sustainability approaches, packaging innovation is at the heart of what ASE does. Today, ASE’s advanced packaging, system-in-package, and chiplet solutions are accelerating growth momentum across AI, Data Center, Automotive, HPC, IoT, 5G, and more. To learn about our technology advances and our VIPack™ platform, please visit aseglobal.com or follow us on LinkedIn and X: @aseglobal.

Micron is an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that Micron’s people create fuel the data economy, enabling advances in artificial intelligence and compute-intensive applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more about Micron Technology, Inc. (Nasdaq: MU), visit micron.com.

Microsoft Corporation, founded in 1975 by Bill Gates and Paul Allen, is a global leader in software, services, and technology solutions. Headquartered in Redmond, Washington, the company is best known for its Windows operating system, Microsoft Office productivity suite, and Azure cloud platform. Over the years, Microsoft has expanded into hardware with products like Surface devices and Xbox, and has acquired major companies such as LinkedIn and GitHub. With a mission to “empower every person and every organization on the planet to achieve more,” Microsoft continues to drive innovation in AI, cloud computing, and digital transformation worldwide.

Winbond Electronics Corporation, founded in 1987 and headquartered in Taichung, Taiwan, is a leading global supplier of semiconductor memory solutions. The company specializes in DRAM and Flash memory products, including NOR Flash, NAND Flash, and Specialty DRAM, widely used in automotive, industrial, consumer electronics, and computer applications. Winbond is recognized for its in-house design and manufacturing capabilities, operating a 12-inch wafer fab to ensure product quality and flexibility. With a strong focus on innovation, reliability, and low-power solutions, Winbond supports the growing demand for connected devices and continues to play an important role in enabling advancements in the digital era.