Navigate Your Way to a Career in Semiconductors: UC Los Angeles
Location:
UCLA Career Center
Strathmore Building
Room 200
Los Angeles, California 78712
Engineering Intelligence: Building the Future of AI
From the chips that power AI to the systems that bring it to life, engineers are driving the technologies reshaping how we live, work, and connect. As demand for performance, efficiency, and scale continues to grow, innovation now depends on collaboration across every layer of the technology stack – from silicon to systems.
This program brings together industry leaders and engineers across disciplines to explore how advances in semiconductor design, systems engineering, and intelligent computing are enabling the next era of AI. Through an inspiring keynote and interactive panel discussion, students will gain insight into the breakthroughs shaping the future of technology – and discover how they can build meaningful careers in this rapidly evolving field.
Agenda
Check in and join us for a fun, interactive session, where you’ll test your knowledge, learn surprising facts about the semiconductor industry, and compete for prizes! Engineering Intelligence: Powering the Next Era of AI Behind every breakthrough in artificial intelligence lies a foundation of innovation in hardware, systems design, and energy-efficient engineering. In this keynote, Emel Goksu, Head of Engineering Planning & Productivity – AI Systems & Accelerated Platforms at Meta, will explore how advances across the semiconductor and systems ecosystem are enabling the next generation of AI – and redefining what’s possible in intelligent computing. She’ll share insights on how collaboration across disciplines is accelerating progress, the skills and mindsets engineers need to drive this transformation, and how students can prepare to build meaningful careers in a field that’s shaping the future of technology and global innovation. From Silicon to Systems: Engineering the Future of AI AI is driving a new wave of innovation that spans every layer of technology – from semiconductor design and manufacturing to systems integration and test. In this moderated panel discussion, industry engineers and technologists will explore how collaboration across the hardware and systems ecosystem is advancing AI performance, efficiency, and scale. Panelists will also share insights on how roles and skills are evolving, what it takes to thrive in this rapidly changing field, and how students can prepare to contribute to the technologies powering the future of intelligent systems. Moderator: Panelists: Join us for refreshments and connect with industry professionals. This is a great opportunity to exchange ideas, discuss career paths, and build valuable connections in the semiconductor field.Check In and Tech Challenge
Keynote
Panel Discussion
Nitza Basaco – Mobility Business Unit Manager, Teradyne
Anusha Arcalgud – Applications Engineer, Siemens
Sruba Seshadri – Senior Account Executive, Cadence
Siddharth Srivastava – Global Product Manager, Applied MaterialsNetworking and Refreshments
Participating Companies
