2026 Lunch & Learn – EMEA, Belgium

Lin Hou

Principal Engineer

Sandisk

Lin Hou received her PhD in Materials Engineering from KU Leuven and imec, where she conducted research under the supervision of Ingrid De Wolf and Eric Beyne. Her doctoral research was carried out within imec’s advanced semiconductor research ecosystem and focused on advanced 3D integration and packaging technologies. At the time, this field was still emerging, and her work contributed to early research efforts exploring new approaches for high-density integration—technologies that are now seeing large-scale adoption across the semiconductor industry. 

Following her graduation, she joined SanDisk as a Staff Engineer and began her industry career working on collaborative research programs between imec and SanDisk. Her work continued to build on advanced integration and packaging technologies, contributing to joint development programs aimed at enabling next-generation memory architectures. 

She is currently a Principal Engineer at SanDisk, where she leads and contributes to research and development in advanced and emerging memory technologies. Her work spans advanced integration, and technology development for next-generation memory solutions. 

In addition to her technical contributions, she has served as both project manager and technical lead for several cross-functional R&D programs involving device integration, fabrication, and coordination. Throughout her career, she has played key roles in multiple strategic technology initiatives and has led multidisciplinary teams across engineering and manufacturing functions to deliver core research and technology programs. 

An active contributor to innovation in the semiconductor industry, she has authored 30+ patent filings and continues to drive technology development in emerging memory and advanced semiconductor integration.

Olivera Stojanovic

Chief Technology Officer

Vtool

Olivera Stojanovic is a Chief Technology Officer at Vtool and Product Owner of Cogita-PRO, an AI-powered debugging and verification assistance platform purpose-built to address the complex, real-world challenges of modern semiconductor verification.

With more than two decades of semiconductor industry experience, Olivera brings deep technical expertise across ASIC and FPGA verification, project management, and building high-performing verification teams. As CTO, she drives the strategic adoption of AI and emerging technologies in collaboration with leading semiconductor companies, translating their most critical verification challenges into intelligent, scalable solutions.

In her role as Product Owner of Cogita-PRO, Olivera defines the product vision and steers the development roadmap ensuring the platform evolves in direct alignment with the needs of verification professionals. Her extensive hands-on verification background gives her a rare and valuable perspective on where AI delivers the greatest practical impact: from accelerating root cause analysis to significantly reducing the complexity and duration of debug cycles.

Olivera holds an MSc in Electrical Engineering from the School of Electrical Engineering, University of Belgrade, and an Executive MBA from Cotrugli Business School.   Throughout her career, Olivera has actively collaborated with academic institutions in Serbia, to promote ASIC development and education. She is a co-author of verification textbook published by the Faculty of Electronic Engineering at the University of Niš. She is also a member of the GSA EMEA Women’s Leadership Council, where she contributes to advancing women in the global semiconductor industry.

(https://thevtool.com/)

Sadb Nic Fhionnbhairr

Senior Manager, Automotive Sales – Global Accounts

Samsung

Sadb Nic Fhionnbhairr is a senior global account leader in the automotive semiconductor industry, with experience across the automotive, technology and energy sectors. She is Senior Manager, Automotive Sales at Samsung Semiconductor Europe in Munich. Sadb works with leading global automotive manufacturers and suppliers on strategically-significant automotive business. Her work supports the integration of advanced semiconductor and AI-acceleration technologies into complex automotive applications. She offers a global perspective on the dynamics between automotive manufacturers, suppliers and technology companies. Her career focuses on shaping and expanding long-term partnerships across complex stakeholder engagements within the context of international business environments.

Nicole Tien

Senior Technical Program Manager

ASE

Nicole Tien is a Senior Technical Program Manager at ASE Europe, where she drives advanced packaging technology development and innovation to support customer growth and ecosystem collaboration. She focuses on high-performance heterogeneous integration, including multi-die and 3D packaging solutions, enabling improved system-level performance, bandwidth, and energy efficiency. Nicole works closely with customers and industry partners to translate emerging requirements into scalable packaging solutions, supporting applications across AI, automotive, and high-performance computing. She is actively involved in advancing packaging strategies that push the limits of thermal, electrical, and mechanical performance, helping to enable next-generation semiconductor systems