The Rising Women of Influence Award recognizes and profiles the next generation of women leaders in the semiconductor industry. Companies are encouraged to identify women with a technical background and education within their organization that they believe will be one of their key corporate executives over the next three years. Nominations will be reviewed by an all-female executive committee that will select the top three candidates for recognition at the GSA Annual awards Dinner. There, a winning recipient will be announced and presented with the Rising Women of Influence Award.
VP & GM Fab Management
Hui Peng Koh is Vice President and General Manager of GF’s New York advanced semiconductor facility, a position she was appointed to in May 2023. Ms. Koh brings more than 23 years of extensive experience in semiconductor research, development, and high-volume manufacturing and global leadership with multi-national organizational management. She specializes in equipment and process engineering innovation and large-scale operational performance and cost management and has a proven track record of delivering transformative business results and developing strong workforce talent pools.
Ms. Koh started her career in 2000 as a lithography process development engineer at GF’s Singapore facility. After delivering multiple successful new technology nodes in Singapore, Ms. Koh relocated to the United States in 2011 to lead a research program for GF in EUV lithography in Albany, N.Y.
During her tenure at the Malta, New York site, Ms. Koh expanded her fab leadership portfolio as a module engineering executive since 2015 and more recently as vice president of engineering. She has successfully ramped up the site, executing GF’s pivot to the diversification of product and customer landscape, with year-over-year capacity/revenue growth as well as record operational/cost performance achievement.
Ms. Koh holds a master’s degree in materials engineering from Nanyang Technical University Singapore.
Senior Director of RFIC Engineering
Rozi Roufoogaran is the Senior Director of RFIC Engineering at NXP, leading the Ultra-Wideband technology radio development. The products she has lead are shipping today in many of the tier 1 mobile handset companies and numerous IOT devices. Prior to NXP, she was the VP of Semiconductor Engineering at Ethertronics Inc, a startup acquired by AVX corporation in Jan 2018, where she lead the team responsible for their innovative line of active antenna products. Before Ethertronics, she held a number of senior management positions during her 17 years at Broadcom Ltd, responsible for the design and development of CMOS RF and analog circuits for varieties of wireless communication standards, including Bluetooth, Zigbee, WLAN, FM radio, and GPS. Rozi joined Broadcom in 2000 after Innovent Systems, the first company to develop single chip CMOS RF devices, was acquired by Broadcom. The innovations she has pioneered are still part of numerous chips shipping in the billions of units at Broadcom.
Rozi received her M.S. degree in Electrical Engineering from UCLA. She is the co-author of 15 journal and conference papers and is an inventor or co-inventor of over 22 patents.
Rozi volunteers as a leader of the programs and projects committee at GSA’s women’s initiatives. She is also involved with ECE alumnae advisory committee at UCLA.
Intel Fellow and the Director of Package Research and Systems Solutions in Components Research within Technology Development
Johanna M. Swan is an Intel Fellow and the Director of Package Research and Systems Solutions in Components Research within Technology Development at Intel Corporation. She leads a multidisciplinary team of researchers charged with developing novel technologies and package architectures to enable continued semiconductor scaling, mm-wave communications at various length scales and differentiating capabilities within packaging.
An expert in advanced electronic packaging technologies, Swan began her Intel career in 2000, focusing initially on packaging solutions for wireless, cellular and memory products. She initiated Intel’s first through silicon via (TSV) die stacking program and led research in early TSV architectures. She and her team also developed a stacked-package chip-scale package (CSP) and a mixed-technology CSP. Since assuming her current role in 2006, Swan and her team have pioneered numerous innovative packaging technologies, including a multi-die interconnect silicon bridge and an associated enabling printing solution (EMIB) as well as more recent technologies such as Foveros Omni (ODI). She holds over 300 patents worldwide primarily in the field of electronic packaging. Before joining Intel, Swan spent 16 years at Lawrence Livermore National Lab (LLNL) and specific to the semiconductor industry she designed and developed a visible light alignment system for the Extreme Ultraviolet Lithography (EUVL) projection optics as part of the joint Virtual National Labs EUVL program. She holds a Bachelor of Science in Mechanical Engineering.
Vice President of Global Frontend Procurement
Micron Technology, Inc.
Thy Tran, Vice President of Global Frontend Procurement at Micron Technology, Inc., recently transitioned from her prior role as VP of DRAM Process Integration where she led a global team in the US and Asia to drive DRAM technology development and transfer into high-volume manufacturing fabs. She has nearly 30 years of semiconductor experience working in the US, Europe, and Asia, including two semiconductor fab startups.
Ms. Tran joined Micron in 2008 and led several DRAM module development programs including Advanced Capacitor, Metallization, and Through-Silicon-Via (TSV) integration before taking on the DRAM Process Integration node leadership role for several generations. Her technical contribution has been integral to Micron’s DRAM Technology Development Roadmap and played a significant role in helping Micron achieve DRAM technology leadership. Prior to Micron, Ms. Tran worked on Logic and SRAM technologies at Motorola, Inc. and SRAM at WaferTech, LLC. At Siemens, AG., which later spun off to Infineon and Qimonda, AG. she held several leadership roles in DRAM technology development transfer, and manufacturing.
Ms. Tran graduated from the University of Washington with a Bachelor of Science in Electrical Engineering. She is a recent alumnus of the Stanford Graduate School of Business’s Executive Program and the McKinsey Executive Leadership Program. She is a senior member of IEEE, member of the Society of Women Engineers, and serves as a Strategic Advisory board member for the University of Washington’s Electrical and Computer Engineering department, International Semiconductor Executive Summit, and Mercado Global.
Corporate Vice President, Software Development
Caixia Jiang is a Corporate Vice President of Software development at AMD, responsible for 3D graphics driver and complier development. She has worked at AMD for 28 years focusing on advancing 3D graphics technology. Prior to joining AMD, Caixia worked as a staff scientist and software developer at several startup companies in image processing and 3D graphics. Caixia studied electrical engineering in college and earned her Ph.D from Worcester Polytechnic Institute in Massachusetts.
Senior Director Technology Development
Isabelle is an Electrical Engineer; she started her career in the semiconductor industry in 2001. She has published and co-authored 100+ publications in the field of device engineering. She joined GlobalFoundries 10 years ago. She has successively led the Device Engineering, Metal Deposition Engineering and Central Engineering teams in Malta, NY. Since 2021, she leads GlobalFoundries’s Technology Development team in Dresden (DE), overseeing the development of eNVM and FDX technologies. Since 2015, she is an active sponsor and member of GlobalWomen, GlobalFoundries’s ERG for the professional development of female employees. She actively contributes to their US and EMEA chapters.
Vice President, Technology Development & Senior Director, Advanced Design & Technology Solutions
Lalitha Immaneni is a Vice President in TD, Intel, responsible for architectures and innovations to support emerging packaging technologies. Her team led the architecture and execution for the industry first Foveros/EMIB products. She is widely recognized in the EDA industry for driving design tools for die disaggregation. She manages a global organization of 200+ employees and strives for a culture of diversity and inclusion. She has a M.S in computer science from Arizona State University. She is an active technical contributor in various industry consortiums. Lalitha volunteers for the AZ Pathways for Women program.
Vice President, Engineering, Memory Technology
Dr. Yan Li has more than 200 patents and is renowned for her work in NAND, including helping develop the first triple-layer cell (TLC) in 2008. She began working at Western Digital (SanDisk) in 1998 and was promoted to vice president in 2018. Dr. Li earned a Ph.D. in Materials Science and Engineering and a master’s degree in Physics from Lehigh University. She has a bachelor’s degree in Modern Physics from the University of Science and Technology of China. She is a graduate of the UC Berkley Engineering Leadership Professional Program.
Fellow & Sr. Director of DFT Architecture
Teresa McLaurin is a Fellow and Senior Director of DFT (Design for Test) Architecture for all of Arm, based in Austin, Texas. In this role, she is responsible for ensuring that all Arm IP (Intellectual Property) are enabled to be tested fully and with high quality by all of Arm’s partners with their myriad of methodologies and flows. To enable this, she must not only…
Qualcomm Technologies, Inc.
Rashmi Char serves as vice president of engineering for Qualcomm Technologies Incorporated. Her current responsibilities include leading the 700-person global product and tools organization and serving as the overall MSM software project engineer for chipsets across the company’s portfolio, the overall IP guardian leading the…
Sr. VP, Hardware Processors Business Unit
Marvell Technology, Inc.
Dina McKinney is Senior Vice President of Hardware for the Processor Business Unit at Marvell. In this role, Dina is responsible for Marvell’s infrastructure processor development and delivering products and new technologies at the forefront of 5G, data center, enterprise and…
Corporate VP, Silicon Design Engineering
Mydung Pham is a corporate vice president of design engineering in the Technology & Engineering Group at AMD. In her current role, Mydung leads AMD’s Central Design Methodology team delivering best in-class tools and methodology to support AMD designs. Her overarching goal…
Corporate Vice President, Silicon Design Engineering,
AMD India Engineering Lead
As India Engineering Lead, Jaya Jagadish is responsible for AMD’s R&D work out of India and for fostering a culture of innovation, inclusive growth and corporate responsibility at the company’s India Development Centre.
Her first stint with AMD was in Austin 1994. She joined the company immediately after completing her master’s in electrical engineering from University of Texas at Dallas.
Senior Director, Technology Development
Micron Technology | Memory Japan
Nahomi Aoto is a Senior Director of Micron Memory Japan. She has been serving semiconductor industry for 37 years. Aoto lead the most advanced process development for DRAM from 2000 to 2018 in Elpida as an executive officer and in Micron as a senior director after the acquisition of Elpida by Micron in 2013. Since 2018 Aoto fills the role of…
Vice President & General Manager of Intel Israel Development Center and Intel Validation Engineering in the Design Engineering Group
Karin Eibschitz-Segal is vice president in the Design Engineering Group and General Manager of Intel Validation Engineering. In this role, she is responsible for delivering Intel’s promise of highest quality products. Based in Israel, Karin is leading the global Intel engineering organization responsible for functional, electrical and power/performance validation…
Head of Design and Technology Platform
Lie-Szu Juang is the deputy head of Design and Technology Platform at TSMC. She leads multiple teams worldwide to enable customer design through design solutions of 3nm, 5nm, 7nm, and specialty technologies like embedded flash, HV/BCD, RF & SOI, and MRAM/RRAM. She is responsible for PDK, foundation library, design flow, and 3rd-party eco-system EDA/IP/service partners to enable 280 customers for 1000 successful project…
Fellow & Chief Technologist for Data Center IP in the Silicon Engineering Group
Amber Huffman is a distinguished Fellow and Chief Technologist for Datacenter IP in the Silicon Engineering Group at Intel Corporation. She currently leads the definition of industry leading IP building blocks for Intel’s Datacenter products (which are responsible for $25B of Intel’s yearly revenue). She is a respected authority on storage, memory and IO architecture, and…
Marta Karczewicz received her M.Sc. and Ph.D. (with honors) degrees from the Tampere University of Technology, Finland, in 1994 and 1997, respectively. From 1996 to 2006, she was with Nokia where she managed the “Visual Technologies” Competence Area, and in 2004 she became the head of the Nokia Research Center in Dallas, Texas. In 2006 she joined Qualcomm, where she is currently a…
Suzanne Plummer is a corporate vice president of Design Engineering at AMD. In this role, she is responsible for the design of AMD discrete GPU products, including the newest Radeon products based on the RDNA Architecture. She leads a team of over 800 full-time engineers and contractors in China, Canada and the United States.
Since joining AMD in 2002, Plummer has led several design…
Linda Somerville is corporate vice president of Technology Development – Mask and Materials Characterization at Micron Technology.
Dr. Somerville joined Micron in 1995 and has held a variety of increasingly responsible positions. In her current role, she leads a large global team within the Technology Development department. Her responsibilities include photomask technology development and fabrication, materials characterization…
Vice President, Engineering
Qualcomm Technologies, Inc.
Vanitha Kumar is a Vice President of Software Engineering at Qualcomm Technologies Incorporated. Vanitha holds a Master of Science degree in Electrical Engineering from Northeastern University, and a Bachelor of Electronics & Communication Engineering degree from PSG College of Technology, India. Vanitha has 20 years of experience in the wireless telecommunications industry and in embedded software architecture, design, and development. She has…
Director, Business Management
TSMC North America
Ching-Wen Cho, Account Director, is responsible for driving multi-billion dollar business in TSMC revenue and enabling strong customer revenue growth (and as a consequence TSMC’s) across a broad range of IDM, Fabless and Emerging Account engagements. Her key roles include setting business strategy and leading operational plan execution to maximize both customer satisfaction and TSMC revenue. She actively leads one of TSMC’s…
Vice President, RF Business Unit
Christine Dunbar is the Vice President of the RF Business Unit at GLOBALFOUNDRIES, where she leads an organization responsible for growing and supporting a global business focused on servicing RF (Radio Frequency) needs for next generation of consumer and enterprise communications. Christine received her Bachelor’s Degree in Materials Science & Engineering from Cornell University in 1996.
Christine joined GLOBALFOUNDRIES in July 2015, when…
Chief People Officer and Executive Vice President
Congratulations to Sandra Rivera for being named Chief People Officer and Executive VP: https://www.businesswire.com/news/home/20190611005761/en
Sandra L. Rivera is senior vice president and general manager of the network platforms group at Intel Corporation. She is responsible for the Intel business group charged with providing innovative technology and solutions to the networking industry. She is also Intel’s…