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The Rising Women of Influence Award recognizes and profiles the next generation of women leaders in the semiconductor industry. Companies are encouraged to identify women with a technical background and education within their organization that they believe will be one of their key corporate executives over the next three years. Nominations will be reviewed by an all-female executive committee that will select the top three candidates for recognition at the GSA Annual awards Dinner. There, a winning recipient will be announced and presented with the Rising Women of Influence Award.
Corporate Vice President, Software Development
AMD
Caixia Jiang is a Corporate Vice President of Software development at AMD, responsible for 3D graphics driver and complier development. She has worked at AMD for 28 years focusing on advancing 3D graphics technology. Prior to joining AMD, Caixia worked as a staff scientist and software developer at several startup companies in image processing and 3D graphics. Caixia studied electrical engineering in college and earned her Ph.D from Worcester Polytechnic Institute in Massachusetts.
Senior Director Technology Development
GlobalFoundries
Isabelle is an Electrical Engineer; she started her career in the semiconductor industry in 2001. She has published and co-authored 100+ publications in the field of device engineering. She joined GlobalFoundries 10 years ago. She has successively led the Device Engineering, Metal Deposition Engineering and Central Engineering teams in Malta, NY. Since 2021, she leads GlobalFoundries’s Technology Development team in Dresden (DE), overseeing the development of eNVM and FDX technologies. Since 2015, she is an active sponsor and member of GlobalWomen, GlobalFoundries’s ERG for the professional development of female employees. She actively contributes to their US and EMEA chapters.
Vice President, Technology Development & Senior Director, Advanced Design & Technology Solutions
Intel Corporation
Lalitha Immaneni is a Vice President in TD, Intel, responsible for architectures and innovations to support emerging packaging technologies. Her team led the architecture and execution for the industry first Foveros/EMIB products. She is widely recognized in the EDA industry for driving design tools for die disaggregation. She manages a global organization of 200+ employees and strives for a culture of diversity and inclusion. She has a M.S in computer science from Arizona State University. She is an active technical contributor in various industry consortiums. Lalitha volunteers for the AZ Pathways for Women program.
Vice President, Engineering, Memory Technology
Western Digital
Dr. Yan Li has more than 200 patents and is renowned for her work in NAND, including helping develop the first triple-layer cell (TLC) in 2008. She began working at Western Digital (SanDisk) in 1998 and was promoted to vice president in 2018. Dr. Li earned a Ph.D. in Materials Science and Engineering and a master’s degree in Physics from Lehigh University. She has a bachelor’s degree in Modern Physics from the University of Science and Technology of China. She is a graduate of the UC Berkley Engineering Leadership Professional Program.
Fellow & Sr. Director of DFT Architecture
ARM
Teresa McLaurin is a Fellow and Senior Director of DFT (Design for Test) Architecture for all of Arm, based in Austin, Texas. In this role, she is responsible for ensuring that all Arm IP (Intellectual Property) are enabled to be tested fully and with high quality by all of Arm’s partners with their myriad of methodologies and flows. To enable this, she must not only…
VP, Engineering
Qualcomm Technologies, Inc.
Rashmi Char serves as vice president of engineering for Qualcomm Technologies Incorporated. Her current responsibilities include leading the 700-person global product and tools organization and serving as the overall MSM software project engineer for chipsets across the company’s portfolio, the overall IP guardian leading the…
Sr. VP, Hardware Processors Business Unit
Marvell Technology, Inc.
Dina McKinney is Senior Vice President of Hardware for the Processor Business Unit at Marvell. In this role, Dina is responsible for Marvell’s infrastructure processor development and delivering products and new technologies at the forefront of 5G, data center, enterprise and…
Corporate VP, Silicon Design Engineering
AMD
Mydung Pham is a corporate vice president of design engineering in the Technology & Engineering Group at AMD. In her current role, Mydung leads AMD’s Central Design Methodology team delivering best in-class tools and methodology to support AMD designs. Her overarching goal…
Corporate Vice President, Silicon Design Engineering,
AMD India Engineering Lead
AMD
As India Engineering Lead, Jaya Jagadish is responsible for AMD’s R&D work out of India and for fostering a culture of innovation, inclusive growth and corporate responsibility at the company’s India Development Centre.
Her first stint with AMD was in Austin 1994. She joined the company immediately after completing her master’s in electrical engineering from University of Texas at Dallas.
Senior Director, Technology Development
Micron Technology | Memory Japan
Nahomi Aoto is a Senior Director of Micron Memory Japan. She has been serving semiconductor industry for 37 years. Aoto lead the most advanced process development for DRAM from 2000 to 2018 in Elpida as an executive officer and in Micron as a senior director after the acquisition of Elpida by Micron in 2013. Since 2018 Aoto fills the role of…
Vice President & General Manager of Intel Israel Development Center and Intel Validation Engineering in the Design Engineering Group
Intel Corporation
Karin Eibschitz-Segal is vice president in the Design Engineering Group and General Manager of Intel Validation Engineering. In this role, she is responsible for delivering Intel’s promise of highest quality products. Based in Israel, Karin is leading the global Intel engineering organization responsible for functional, electrical and power/performance validation…
Head of Design and Technology Platform
TSMC
Lie-Szu Juang is the deputy head of Design and Technology Platform at TSMC. She leads multiple teams worldwide to enable customer design through design solutions of 3nm, 5nm, 7nm, and specialty technologies like embedded flash, HV/BCD, RF & SOI, and MRAM/RRAM. She is responsible for PDK, foundation library, design flow, and 3rd-party eco-system EDA/IP/service partners to enable 280 customers for 1000 successful project…
Fellow & Chief Technologist for Data Center IP in the Silicon Engineering Group
Intel Corporation
Amber Huffman is a distinguished Fellow and Chief Technologist for Datacenter IP in the Silicon Engineering Group at Intel Corporation. She currently leads the definition of industry leading IP building blocks for Intel’s Datacenter products (which are responsible for $25B of Intel’s yearly revenue). She is a respected authority on storage, memory and IO architecture, and…
Qualcomm Incorporated
Marta Karczewicz received her M.Sc. and Ph.D. (with honors) degrees from the Tampere University of Technology, Finland, in 1994 and 1997, respectively. From 1996 to 2006, she was with Nokia where she managed the “Visual Technologies” Competence Area, and in 2004 she became the head of the Nokia Research Center in Dallas, Texas. In 2006 she joined Qualcomm, where she is currently a…
Suzanne Plummer is a corporate vice president of Design Engineering at AMD. In this role, she is responsible for the design of AMD discrete GPU products, including the newest Radeon products based on the RDNA Architecture. She leads a team of over 800 full-time engineers and contractors in China, Canada and the United States.
Since joining AMD in 2002, Plummer has led several design…
Linda Somerville is corporate vice president of Technology Development – Mask and Materials Characterization at Micron Technology.
Dr. Somerville joined Micron in 1995 and has held a variety of increasingly responsible positions. In her current role, she leads a large global team within the Technology Development department. Her responsibilities include photomask technology development and fabrication, materials characterization…
Vice President, Engineering
Qualcomm Technologies, Inc.
Vanitha Kumar is a Vice President of Software Engineering at Qualcomm Technologies Incorporated. Vanitha holds a Master of Science degree in Electrical Engineering from Northeastern University, and a Bachelor of Electronics & Communication Engineering degree from PSG College of Technology, India. Vanitha has 20 years of experience in the wireless telecommunications industry and in embedded software architecture, design, and development. She has…
Director, Business Management
TSMC North America
Ching-Wen Cho, Account Director, is responsible for driving multi-billion dollar business in TSMC revenue and enabling strong customer revenue growth (and as a consequence TSMC’s) across a broad range of IDM, Fabless and Emerging Account engagements. Her key roles include setting business strategy and leading operational plan execution to maximize both customer satisfaction and TSMC revenue. She actively leads one of TSMC’s…
Vice President, RF Business Unit
GLOBALFOUNDRIES
Christine Dunbar is the Vice President of the RF Business Unit at GLOBALFOUNDRIES, where she leads an organization responsible for growing and supporting a global business focused on servicing RF (Radio Frequency) needs for next generation of consumer and enterprise communications. Christine received her Bachelor’s Degree in Materials Science & Engineering from Cornell University in 1996.
Christine joined GLOBALFOUNDRIES in July 2015, when…
Chief People Officer and Executive Vice President
Intel Corporation
Congratulations to Sandra Rivera for being named Chief People Officer and Executive VP: https://www.businesswire.com/news/home/20190611005761/en
Sandra L. Rivera is senior vice president and general manager of the network platforms group at Intel Corporation. She is responsible for the Intel business group charged with providing innovative technology and solutions to the networking industry. She is also Intel’s…