- AI
- Design
- Process
- System
- Test
Artificial Intelligence (AI)
Application of AI to Accelerate Formal verification workflow
Liya Liu
AMD
Srividya Jayaram
Siemens EDA
An advanced process control system using the Virtual Metrology model for run-to-run control is proposed which incorporates measurements, design, fault detection and classification features to achieve the desired thickness target for the Chemical Vapor Deposition process.
AOn-the-Fly Machine Learning Model for Future 3D NAND Trim Optimization
Rachel Son
Sandisk
Srividya Jayaram
Siemens EDA
An advanced process control system using the Virtual Metrology model for run-to-run control is proposed which incorporates measurements, design, fault detection and classification features to achieve the desired thickness target for the Chemical Vapor Deposition process.
Agent-AI Assisted Parameter Turning in Active Electrical Cables for Device Interoperability
Tingting Weng
Marvell Technology
Srividya Jayaram
Siemens EDA
An advanced process control system using the Virtual Metrology model for run-to-run control is proposed which incorporates measurements, design, fault detection and classification features to achieve the desired thickness target for the Chemical Vapor Deposition process.
Design Technology
Low-Power Architectures for Clock Domain Crossing in SoC Design
Aradhana Kumari
STMicroelectronics
Srividya Jayaram
Siemens EDA
An advanced process control system using the Virtual Metrology model for run-to-run control is proposed which incorporates measurements, design, fault detection and classification features to achieve the desired thickness target for the Chemical Vapor Deposition process.
Optimizing ECO Efficiency and Precision: an alternative approach for Implementing Digital- Intensive RTL Module Restructuring Through Metal Changes in IC Design
Carmen Galotta
STMicroelectronics
Srividya Jayaram
Siemens EDA
An advanced process control system using the Virtual Metrology model for run-to-run control is proposed which incorporates measurements, design, fault detection and classification features to achieve the desired thickness target for the Chemical Vapor Deposition process.
CDC Techniques Without Synchronizers: Holistic Approach for High Quality Low Power Design
Sangeeta Raste
AMD
Srividya Jayaram
Siemens EDA
An advanced process control system using the Virtual Metrology model for run-to-run control is proposed which incorporates measurements, design, fault detection and classification features to achieve the desired thickness target for the Chemical Vapor Deposition process.
Process Technology/Packaging/Assembly Technology
Novel Dry Etch Process Technology Enabling Precision at the Nanoscale: Pushing the Limits of Advanced EUV Patterning
Navigating the challenges of Physical Verification in 3DICs: From 2D to 3D solutions
System Technology
Hardware Trust, Firmware Assurance: A Rust-based Root-of-Trust for Modern Secure Systems
Test/Validation
Enhancing Margin Analysis through Dynamic Dashboards: A Case Study on High-Speed SERDES Link using Power BI and Snowflake
From Lab to Data Center: Accelerating Silicon Readiness Through Reliability Innovation