- AI
- Design
- Process
- System
- Test
Artificial Intelligence (AI)
Accelerating FPGA Physical Design Closure through Generative AI
Mrunal Sagare
Lattice Semiconductor
Srividya Jayaram
Siemens EDA
An advanced process control system using the Virtual Metrology model for run-to-run control is proposed which incorporates measurements, design, fault detection and classification features to achieve the desired thickness target for the Chemical Vapor Deposition process.
Agents on Rails: Deterministic AI for Chip Sign-Off
Abhishikta Pandit
META
Srividya Jayaram
Siemens EDA
An advanced process control system using the Virtual Metrology model for run-to-run control is proposed which incorporates measurements, design, fault detection and classification features to achieve the desired thickness target for the Chemical Vapor Deposition process.
ARTEMIS: A Multi-Agent AI System for Automated Root-Cause Analysis and Optimization of RTL Verification Workflows
Nupur Bhonge
AWS
Srividya Jayaram
Siemens EDA
An advanced process control system using the Virtual Metrology model for run-to-run control is proposed which incorporates measurements, design, fault detection and classification features to achieve the desired thickness target for the Chemical Vapor Deposition process.
From Specification to Proof: AI Agent Automation of AEP and FPV Workflows
Liya Liu
AMD
Srividya Jayaram
Siemens EDA
An advanced process control system using the Virtual Metrology model for run-to-run control is proposed which incorporates measurements, design, fault detection and classification features to achieve the desired thickness target for the Chemical Vapor Deposition process.
Formal Verification in the Age of Generative and Agentic AI
Pallavi Atha
Astera Labs
Srividya Jayaram
Siemens EDA
An advanced process control system using the Virtual Metrology model for run-to-run control is proposed which incorporates measurements, design, fault detection and classification features to achieve the desired thickness target for the Chemical Vapor Deposition process.
Keep Your Data, Share the Model: Federated Learning for Privacy-Preserving Hardware Anomaly Detection Across Distributed Fleets
Cynara Justine
Microsoft
Srividya Jayaram
Siemens EDA
An advanced process control system using the Virtual Metrology model for run-to-run control is proposed which incorporates measurements, design, fault detection and classification features to achieve the desired thickness target for the Chemical Vapor Deposition process.
Design Technology
Achieving Glitch Power Visibility via Delay-Shifted Analysis for Actionable Power Optimization
Neetu Mehta
AMD
Srividya Jayaram
Siemens EDA
An advanced process control system using the Virtual Metrology model for run-to-run control is proposed which incorporates measurements, design, fault detection and classification features to achieve the desired thickness target for the Chemical Vapor Deposition process.
Constraint-Driven Routing Closure for High-Frequency Mixed-Signal Designs
Rajashri Lakhotia
Lattice Semiconductor
Srividya Jayaram
Siemens EDA
An advanced process control system using the Virtual Metrology model for run-to-run control is proposed which incorporates measurements, design, fault detection and classification features to achieve the desired thickness target for the Chemical Vapor Deposition process.
Executable Interrupt Specifications: Managing Control-Plane Complexity in Disaggregated Server SoCs
Sindhu Amireddy
Microsoft
Srividya Jayaram
Siemens EDA
An advanced process control system using the Virtual Metrology model for run-to-run control is proposed which incorporates measurements, design, fault detection and classification features to achieve the desired thickness target for the Chemical Vapor Deposition process.
Process/Packing/Assembly Technology
Failure Analysis Challenges of Advanced Packaging
Susan Li
Marvell Technology
Srividya Jayaram
Siemens EDA
An advanced process control system using the Virtual Metrology model for run-to-run control is proposed which incorporates measurements, design, fault detection and classification features to achieve the desired thickness target for the Chemical Vapor Deposition process.
Mechanism-Driven Etch-Passivation Balance Engineering for LCDU Convergence Across Hybrid EUV Geometries
Jasmine Chang
Micron Technology
Srividya Jayaram
Siemens EDA
An advanced process control system using the Virtual Metrology model for run-to-run control is proposed which incorporates measurements, design, fault detection and classification features to achieve the desired thickness target for the Chemical Vapor Deposition process.
Split-Gate Inter-Poly Architecture for Electrical Gate Leakage and Mechanical Wafer Warpage Optimization in Trench FP-MOSFETs
Irene Monica Lasar
STMicroelectronics
Srividya Jayaram
Siemens EDA
An advanced process control system using the Virtual Metrology model for run-to-run control is proposed which incorporates measurements, design, fault detection and classification features to achieve the desired thickness target for the Chemical Vapor Deposition process.
System Technology
Making True Single-Stage EV Charging Practical: System-Level Redesign of a Dual-Active-Bridge On-Board Charger Enabled by Bidirectional GaN and Closed-Form Control
Sara Bourouga
STMicroelectronics
Srividya Jayaram
Siemens EDA
An advanced process control system using the Virtual Metrology model for run-to-run control is proposed which incorporates measurements, design, fault detection and classification features to achieve the desired thickness target for the Chemical Vapor Deposition process.
Trivializing Chip Reset Timing: A Novel Technique for SoC Backend Closure
Aradhana Kumari
STMicroelectronics
Srividya Jayaram
Siemens EDA
An advanced process control system using the Virtual Metrology model for run-to-run control is proposed which incorporates measurements, design, fault detection and classification features to achieve the desired thickness target for the Chemical Vapor Deposition process.
Under the Hood of Hardware Systems for Accelerator-Aware Workloads: From Lab to Fleet
Vidya Samyuktha
Microsoft
Srividya Jayaram
Siemens EDA
An advanced process control system using the Virtual Metrology model for run-to-run control is proposed which incorporates measurements, design, fault detection and classification features to achieve the desired thickness target for the Chemical Vapor Deposition process.
Test/Validation
Capping with Confidence: A Test & Validation Framework for Power Savings and a Lower Data-Center Carbon Footprint
Smitha Kashyap C
Microsoft
Srividya Jayaram
Siemens EDA
An advanced process control system using the Virtual Metrology model for run-to-run control is proposed which incorporates measurements, design, fault detection and classification features to achieve the desired thickness target for the Chemical Vapor Deposition process.
On-Device Cryptographic Key Provisioning for PSA Level 3 MCU: Secure Firmware Synthesis and Attestation
Lalitha Abraham
Synaptics
Srividya Jayaram
Siemens EDA
An advanced process control system using the Virtual Metrology model for run-to-run control is proposed which incorporates measurements, design, fault detection and classification features to achieve the desired thickness target for the Chemical Vapor Deposition process.
Scaling Electro-Optical Test and Reliability Validation of Silicon Photonics for AI and Hyperscale Data Centers
Tala Sidawi
Ayar Labs
Srividya Jayaram
Siemens EDA
An advanced process control system using the Virtual Metrology model for run-to-run control is proposed which incorporates measurements, design, fault detection and classification features to achieve the desired thickness target for the Chemical Vapor Deposition process.